1/10/2023 0 Comments Helicon remote 3.6.2 crack![]() ![]() Many of the materials and processes described as likely directions in the first edition of this book have become standard in today’s chip fabrication facilities: for example (1) dual damascene processes, including both insulator and metal polished using CMP, (2) use of electroplating of copper, which at one time was considered to be potentially fatal, and (3) fluorine-doped silicon dioxide followed by low-dielectric films containing silicon, carbon, hydrogen, and oxygen, and increasing discussion on the use of porous films. In situ monitoring of several processes has become routine. This again has led to process innovations and improvement in equipment for depositing and patterning conducting and insulating films. ![]() In parallel, the decreasing feature size and increasing aspect ratio of lines and studs (vertical vias), along with an increase in the number of wiring levels, have created not only the need for new materials but also unprecedented requirement of reliability per unit interconnect. The interconnection technology is also going through changes, starting with copper wiring in place of AlCu, low-dielectric insulators in place of silicon dioxide, and use of cobalt and nickel silicide in place of titanium silicide for contacts. At the device level, the field effect transistor (FET) speed is continually improved by things such as use of insulating substrates, straining the silicon (channel region), and use of dual- and triple-gate (FINFET) structures. The changes are triggered by many considerations: continued need to provide more functions at lower cost technology features less than 1000 Å requiring new processes, and exponential increase in the number of device elements. Wafer sizes continue to grow with most of the new fabs equipped for 12-inch wafers. Preface Since the first edition of this handbook, semiconductor technology has gone through a continued evolution of new devices and materials like never before. Visit the Taylor & Francis Web site at Taylor & Francis Group is the Academic Division of Informa plc. Interconnects (Integrated circuit technology) 2. Includes bibliographical references and index. Library of Congress Cataloging-in-Publication Data Handbook of semiconductor interconnection technology / edited by Geraldine C. Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation without intent to infringe. For organizations that have been granted a photocopy license by the CCC, a separate system of payment has been arranged. CCC is a not-for-profit organization that provides licenses and registration for a variety of users. For permission to photocopy or use material electronically from this work, please access () or contact the Copyright Clearance Center, Inc. No part of this book may be reprinted, reproduced, transmitted, or utilized in any form by any electronic, mechanical, or other means, now known or hereafter invented, including photocopying, microfilming, and recording, or in any information storage or retrieval system, without written permission from the publishers. Reasonable efforts have been made to publish reliable data and information, but the author and the publisher cannot assume responsibility for the validity of all materials or for the consequences of their use. Reprinted material is quoted with permission, and sources are indicated. Government works Printed in the United States of America on acid-free paper 10 9 8 7 6 5 4 3 2 1 International Standard Book Number-10: 1-57444-674-6 (Hardcover) International Standard Book Number-13: 978-1-57444-674-6 (Hardcover) Library of Congress Card Number 2005054909 This book contains information obtained from authentic and highly regarded sources. Published in 2006 by CRC Press Taylor & Francis Group 6000 Broken Sound Parkway NW, Suite 300 Boca Raton, FL 33487-2742 © 2006 by Taylor & Francis Group, LLC CRC Press is an imprint of Taylor & Francis Group No claim to original U.S. SrikrishnanĪ CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T&F Informa plc. Handbook of Semiconductor Interconnection Technology Second Edition ![]()
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